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研究生: 吳弘彬
研究生(外文): WU, HUNG-PIN
論文名稱: 應用紅外線熱影像於設備監測之研究
論文名稱(外文): A Study on Monitoring Equipment by Applied Infrared Thermal Image
指導教授: 陳輔賢
口試委員: 郭政謙 陳輔賢 楊勝源
口試日期: 2018-06-24
學位類別: 碩士
校院名稱: 聖約翰科技大學
系所名稱: 電機工程系碩士在職專班
學門: 工程學門
學類: 電資工程學類
論文種類: 學術論文
論文出版年: 2019
畢業學年度: 107
語文別: 中文
論文頁數: 39
中文關鍵詞: 熱影像 故障診斷 高壓配電盤 絕緣特性
外文關鍵詞: thermal image fault diagnosis HT switch-board insulation property
相關次數:
  • 被引用 被引用:0
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論 文 摘 要
本論文研究針對熱影像傳輸溫度即時檢測於高壓盤之線上先期故障診斷系統,技術層面涵蓋熱影像的熱能分布訊號分析、高壓配電盤使用狀態、高壓配電盤設備元件的絕緣特性、中央監控端的人機介面程式化、微處理器系統設計製作、乙太網路傳輸方式及資料庫系統運作等相關技術。本論文之主要優點在於量測系統之自主性開發軟、硬體成本較低,且可進行熱影像線上監測及先期故障診斷,人機介面操作簡易。本文研究作品未來可優先推廣至高壓盤的生產廠商,以伴隨配電盤設備出廠販售方式,有利於打開市場的接受度,並提高國內廠商的高壓盤市場競爭力與防護效果。其次可以提供使用於台灣電力公司、高科技產業、高運行傳產業、公共工程及國內大學,技術學院等研究單位,對於高壓盤絕緣劣化所產生之停電成本較高之處所。
關鍵詞:熱影像、故障診斷、高壓配電盤、絕緣特性

ABSTRACT
This research focuses on the early stage fault diagnosis with HT switch-board by means of thermal images when letting out heat, covering the analyses on spreading signals of heat caused by thermal images, the condition of HT switch-board in use, insulation property of HT switch-board equipment units, the central-controlling programmable platform for users and devices, the design and production of microprocessors, and the related transmission technologies of Ethernet and database.
The advantages of this study are: budget cost of software and hardware of monitoring system developed by local manufacturers, thermal image monitoring on line, early stage fault diagnosis, and an accessible operation platform for users.
The product of this research can be promoted to the manufacturers of HT switch-board in the beginning, sold in the way of distribution panel board, which is advantageous to open the market and increase the competition ability of HT switch-board domestically. Later on, the production may also be offered to Taiwan Power Company, high technology fields, crest speed traditional manufacturers, public constructions and such academic units as universities and colleges, and to companies with high supply interruption costs caused by the cracking of insulation of HT switch-board.
Keyword: thermal image, fault diagnosis, HT switch-board, insulation property

目錄
論 文 摘 要 I
ABSTRACT II
致謝 III
目錄 IV
圖目錄 VII
第一章 緒論 13
1.1 研究背景 13
1.2 研究動機 13
1.3 研究目的 14
1.4 研究限制 16
第二章 文獻回顧與探討 16
2.1 國內外相關文獻回顧 16
2.2 熱影像檢測法 19
2.3 TCP/IP網路架構 23
第三章 研究方法與步驟 29
3.1 系統功能 30
3.2 系統架構規劃 32
3.2.1 現場遠端監測單元(採用SOC架構) 32
3.2.2 警報單元 34
3.2.3 中央監控伺服單元(採工業電腦及資料庫系統) 35
3.2.3 主要研究步驟 37
第四章 實驗結果與驗證 38
4.1 實際場域之應用 38
4.2 重要儀器之使用 39
4.3 完成之工作項目及成果 40
第五章 結論與未來展望 41
參考文獻 42


參考文獻
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